About OLIXAt OLIX, we recognize that artificial intelligence is advancing at an unprecedented pace, far surpassing any technology evolution witnessed before. This rapid growth has unveiled a significant infrastructure deficit, making it increasingly challenging to produce chips or energy facilities swiftly enough to meet demand. Presently, the industry continues to utilize a decade-old hardware framework that has reached its peak efficiency. A revolutionary, more rapid, and efficient paradigm is poised to become the foremost economic opportunity of the coming century, giving rise to the most pivotal company of the next ten years. OLIX is at the forefront of this transformation, developing the Optical Tensor Processing Unit (OTPU) that delivers unmatched performance and energy efficiency, surpassing anything currently available.RoleWe are seeking an experienced Senior Assembly Manufacturing Engineer to oversee our front-end packaging processes as we transition from prototype to large-scale production. This pivotal role is about bringing concepts to life. You will be responsible for defining and managing substrate-level assembly processes, including flip-chip bonding, underfill, reflow, and inspection, while serving as the engineering liaison with contract manufacturers responsible for our hardware production. Setting high standards, you will drive Design for Manufacturing/Assembly (DFM/DFA) with our engineering teams, ensuring that every process is meticulously documented and prepared for volume production. With a proven track record in building and scaling front-end packaging processes, you will focus on yield improvement, knowing that the distinction between successful and flawed processes lies in the details. You thrive on tackling complex challenges on the factory floor, rather than merely documenting them.ResponsibilitiesAssembly Process Engineering & New Product Introduction (NPI)You will define and manage assembly processes for intricate electro-mechanical and opto-electronic module hardware, guiding these from initial prototypes through to production. Responsibilities include creating and maintaining manufacturing documentation such as assembly instructions, work standards, process flows, and build records. You will lead DFM/DFA reviews with the engineering teams to ensure that designs are feasible, repeatable, and cost-efficient. Additionally, you will oversee the assembly processes for substrate-level flip-chip bonding (FCB), ensuring stability and yield from the prototype stage to full production. You will also develop and enhance tooling, fixtures, jigs, and build aids to ensure consistent, high-quality assembly, establish readiness criteria for builds, and facilitate organized transitions from engineering to manufacturing. Your support will extend to NPI builds and pilot production, capturing insights and implementing improvements back into design and process definitions.Production Support & RampYou will assist in production ramp planning and execution, ensuring efficient scaling and operational success.
Apr 2, 2026
