About the job
ASM International seeks a Principal or Senior Engineer in Process Engineering to advance semiconductor process technologies for advanced packaging. This position is based in Hwaseong, South Korea and centers on thin-film deposition and materials characterization to support next-generation devices. The role has direct impact on the performance of logic, memory, and power products.
Key responsibilities
- Research, develop, and refine semiconductor processes for advanced packaging, including deposition methods such as ALD, PECVD, PVD, ECP, and surface preparation.
- Design and execute complex experiments using DOE and RSM methodologies, then analyze and interpret the resulting data.
- Develop new films and processes for applications like W2W/D2W hybrid bonding, and perform advanced materials characterization.
- Mentor Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
- Collaborate with customers and marketing teams to define process specifications and support product demonstrations.
- Troubleshoot equipment issues directly and ensure smooth product handover to clients.
- Write technical papers, contribute to intellectual property, and present work to professional audiences.
- Travel up to 10% to support remote sites and customer needs.
- May supervise process engineering technicians and provide input for performance reviews.
Location
This role is located in Hwaseong, South Korea.
