About the job
At Flexcompute, we are pioneers in the realm of physics and technology, uniquely positioning ourselves at the intersection of first-principles physics and advanced neural foundation models. Our innovative approach aims to revolutionize industrial simulation and design, ushering in a new era of engineering defined by the synergy of parallel computing and artificial intelligence.
Our cutting-edge technology showcases the fastest GPU solvers in the world, delivering unprecedented speed enhancements compared to conventional tools. By seamlessly integrating these solvers with our Physics AI Foundation Models, we empower engineers to navigate design spaces that were previously beyond reach. At Flexcompute, we don’t merely accelerate simulations; we enable the solutions to challenges deemed insurmountable, assisting our partners in addressing critical issues across 3D-IC design, aerospace applications, and more.
We are currently seeking an innovative and strategic technical leader to spearhead our new division focused on 3D-IC Thermal-Mechanical Reliability. This pivotal role will see you as the principal architect applying our advanced GPU solvers and Physics AI Foundation Models to a key challenge in the semiconductor industry: ensuring the structural and thermal integrity of advanced packaging.
Your leadership will guide the strategy to resolve high-stakes issues such as warpage, CTE mismatch, and thermally induced stress within 3D-ICs and chiplet architectures. You will not merely be utilizing existing tools; you will be shaping the future of AI and high-performance computing (HPC) as they converge to make large-scale 3D chip production feasible.
