About the job
Flexcompute is a pioneering technology startup focused on creating ultra-fast simulation technology that empowers companies to design and optimize innovative technology products. Our award-winning solutions are utilized in the design of a wide range of applications, including airplanes, wind turbines, quantum computing chips, virtual and augmented reality headsets, data centers, and smartphones. Our team comprises globally recognized experts in scientific computing, and we operate with a distributed workforce across Europe, Asia, North America, and South America.
Our Mission
As the semiconductor industry confronts a "thermal wall," with chip power densities surpassing 1000W, traditional design cycles are unable to keep pace. Flexcompute is seeking a visionary Lead to drive our expansion into the chip cooling sector. You will leverage our proprietary, high-performance physics simulation technology to assist clients in designing next-gen liquid cooling systems, immersion cooling solutions, and advanced heat sinks for AI and high-performance computing hardware.
Key Responsibilities
- Strategy & Product Roadmap: Develop strategies for optimizing Flexcompute’s solver technology for thermal management, including microfluidics, phase-change materials, and 3D integrated circuit packaging.
- Technical Leadership: Serve as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
- Solution Architecting: Collaborate directly with Tier 1 semiconductor companies and hyperscalers to address complex thermal challenges using Flexcompute’s simulation platform.
- Market Evangelism: Showcase the advantages of our rapid-cycle simulation over traditional CFD tools to industry leaders including Nvidia, Intel, TSMC, and cooling specialists.
- Team Building: Recruit and mentor a team of thermal application engineers to support our expanding semiconductor portfolio in the future.
