About the job
About Etched
At Etched, we are revolutionizing the AI chip landscape by designing ASICs that are tailor-made for specific model architectures. Our flagship product, Sohu, is engineered to support transformers with unparalleled throughput and reduced latency compared to traditional GPUs. With our advanced ASIC technology, we enable the development of innovative applications such as real-time video generation and highly sophisticated reasoning agents.
Job Overview
We are on the lookout for an experienced PCB Rework Technician, adept in large BGA rework (specifically components greater than 70mm) and intricate board-level repairs involving fine-pitch components down to 0402. This pivotal position will play a significant role in assisting our engineering, validation, and bring-up processes by executing high-reliability rework on cutting-edge PCBs that support our custom ASICs.
Key Responsibilities
Carry out precision rework and re-balling of very-large BGAs (custom ASIC packages over 70 mm) with a high first-pass yield.
Operate large-format BGA rework systems, ensuring precise alignment and controlled thermal profiles for optimal re-flow on high-pin-count ICs.
Rework SMT and through-hole components down to 0402 packages, ensuring exceptional workmanship and consistency across all boards.
Interpret ECNs, schematics, layout files, and BOMs to implement component swaps and design modifications accurately.
Execute advanced board-level repairs including trace cuts, jumper-wire additions, micro-soldering, and circuit rerouting.
Inspect reworked assemblies using X-ray or AOI equipment to ensure solder-joint integrity, alignment, and overall quality.
Document rework processes meticulously and communicate findings or suggestions for improvements to engineers.
Collaborate effectively with hardware, validation, and bring-up teams to facilitate rapid iteration and meet tight project deadlines.
Ideal Candidate Profile
Minimum of 5 years of hands-on experience in PCB rework for production-quality and/or R&D hardware.
Demonstrated expertise with large BGAs (over 70 mm), fine-pitch QFNs/BGAs, and 0402-scale components.
Proficient in using advanced hot-air/IR rework platforms, precision microscopes, and large-area heaters specifically designed for custom ASICs or high-power devices.

