About the job
At d-Matrix, we are dedicated to harnessing the power of generative AI to innovate technology. As industry leaders in both software and hardware, we continually push the limits of what can be achieved. Our culture is built on respect and collaboration, emphasizing humility and direct communication.
We celebrate inclusivity, where diverse perspectives lead to superior solutions. We invite passionate individuals who are eager to tackle challenges and are driven by results to join us. Are you ready to explore your potential? Together, we can redefine the endless possibilities of AI.
Role Overview
We are in search of an enthusiastic Manufacturing Engineering Intern with a solid foundation in Electrical Engineering to join our Operations team. This role serves as a vital link between design and physical hardware, focusing on the PCB lifecycle from initial layout to bare board fabrication.
This is a remarkable opportunity for students or recent graduates looking to dive into the AI hardware sector. You will work at the convergence of design, quality, and manufacturing, ensuring our high-performance boards are crafted for optimal reliability, scalability, and signal integrity.
Key Responsibilities
- Design-to-Release Orchestration: Engage in the entire PCB design release process, including reviewing Gerber files, validating stack-ups, and addressing DFM (Design for Manufacturing) inquiries from external fabrication vendors.
- Supplier Yield Monitoring: Monitor and analyze manufacturing yields at PCB suppliers, providing performance updates to the Operations team while pinpointing areas for process enhancement.
- Quality & Compliance: Assist in bare PCB qualification and acceptance testing, adhering strictly to IPC standards (IPC-A-600/610).
- Cross-Functional Analysis: Conduct thorough data analysis on test coupon measurements, collaborating directly with Signal Integrity (SI) leads to ensure physical boards meet high-speed performance benchmarks.
- Technology Research: Execute market research on emerging PCB technologies, advanced substrate materials, and new supplier capabilities to establish a robust internal knowledge base.
