About the job
ASM International N. V. seeks a Principal or Senior Engineer in Process Engineering (Advanced Packaging) to join the team in Hsinchu, Taiwan. This position plays a key role in developing semiconductor process technologies, with a focus on thin-film deposition and advanced materials characterization for next-generation logic, memory, and power devices.
What you will do
- Research, develop, and refine semiconductor processes for Advanced Packaging, covering ALD, PECVD, PVD, ECP depositions, and surface preparation.
- Design and execute complex experiments using DOE (Design of Experiments) and RSM (Response Surface Methodology), then interpret and analyze the results.
- Develop new films or processes for applications such as W2W/D2W hybrid bonding and carry out advanced materials characterization.
- Mentor Process Engineers, lead technical problem-solving, and apply scientific tools like Ishikawa diagrams.
- Collaborate with customers and marketing teams to define requirements and deliver demonstrations.
- Troubleshoot equipment issues and support product transfer to clients.
- Prepare technical papers, contribute to Intellectual Property, and present findings at industry conferences.
- Travel up to 10% for remote site support and customer meetings.
- May supervise process engineering technicians and assist with performance reviews.
Role focus
This role centers on advancing processes for semiconductor packaging, especially in thin-film deposition and materials analysis. The position offers the chance to guide technical problem-solving and mentor junior engineers while working closely with both internal teams and external partners.
