About the job
As complexity and multifunctionality in semiconductor packages increase, enhancing our technical capabilities and bolstering our development organization is vital. We invite experienced engineers in semiconductor post-processing to contribute to this exciting evolution.
This role allows you to engage with pioneering technologies, developing high-density, thermally efficient packages for AI and HPC, as well as reliable packages for automotive and IoT applications. You will play a crucial role in packaging technologies that are integral to societal innovations, including AI and autonomous driving.
【Key Responsibilities】
Your primary responsibilities will include technology development in the semiconductor post-process, specifically in assembly, packaging, and testing.
- Develop and evaluate advanced package technologies such as FCLGA, FCCSP, and BGA.
- Enhance and optimize assembly processes, including solder paste printing, component mounting, flip chip bonding, reflow processes, and flux cleaning.
- Support production line start-ups and facilitate transitions to mass production.
- Engage in process quality and yield improvement initiatives.
