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Lead of Thermal Systems & Simulation in Semiconductor Industry

FlexcomputeWatertown, Massachusetts, United States
On-site Full-time

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Experience Level

Manager

Qualifications

Education: PhD or MS in Mechanical Engineering, Applied Physics, or a similar field with a focus on Heat Transfer and Fluid Dynamics. Experience: Over 8 years in thermal management for electronics, likely having led thermal architecture for high-TDP processors or high-performance server systems. Simulation Mastery: Expert-level proficiency in thermal simulation tools, with a solid understanding of the underlying physics to articulate the transformative nature of GPU-accelerated or novel solver approaches. Industry Knowledge: Profound familiarity with the AI hardware roadmap, OCP (Open Compute Project) standards, and the shift from air to liquid cooling.

About the job

Flexcompute is a pioneering technology startup focused on creating ultra-fast simulation technology that empowers companies to design and optimize innovative technology products. Our award-winning solutions are utilized in the design of a wide range of applications, including airplanes, wind turbines, quantum computing chips, virtual and augmented reality headsets, data centers, and smartphones. Our team comprises globally recognized experts in scientific computing, and we operate with a distributed workforce across Europe, Asia, North America, and South America.

Our Mission

As the semiconductor industry confronts a "thermal wall," with chip power densities surpassing 1000W, traditional design cycles are unable to keep pace. Flexcompute is seeking a visionary Lead to drive our expansion into the chip cooling sector. You will leverage our proprietary, high-performance physics simulation technology to assist clients in designing next-gen liquid cooling systems, immersion cooling solutions, and advanced heat sinks for AI and high-performance computing hardware.

Key Responsibilities

  • Strategy & Product Roadmap: Develop strategies for optimizing Flexcompute’s solver technology for thermal management, including microfluidics, phase-change materials, and 3D integrated circuit packaging.
  • Technical Leadership: Serve as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
  • Solution Architecting: Collaborate directly with Tier 1 semiconductor companies and hyperscalers to address complex thermal challenges using Flexcompute’s simulation platform.
  • Market Evangelism: Showcase the advantages of our rapid-cycle simulation over traditional CFD tools to industry leaders including Nvidia, Intel, TSMC, and cooling specialists.
  • Team Building: Recruit and mentor a team of thermal application engineers to support our expanding semiconductor portfolio in the future.

About Flexcompute

At Flexcompute, we are at the forefront of technological innovation in simulation technology. Our mission is to revolutionize how companies approach product design in the semiconductor industry, particularly in the face of emerging thermal management challenges. We pride ourselves on our award-winning products and our commitment to fostering a collaborative and expert-driven work environment.

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