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Principal Thermal-Mechanical Engineer

vinci4dSingapore
Remote Full-time

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Experience Level

Mid to Senior

Qualifications

QualificationsMaster's degree in Mechanical Engineering, Physics, or a closely related field. Proven experience in thermal and thermo-mechanical simulation and analysis. Strong leadership skills with a track record of mentoring and developing engineering teams. Exceptional communication skills for effective collaboration with clients and internal teams. Ability to translate complex technical concepts into practical solutions for customers. Prior experience in semiconductor or electronic packaging industries is highly desirable.

About the job

About Us

At vinci4d, we are pioneering the future of hardware design through our innovative Physics AI platform. Our cutting-edge software empowers hardware designers and physics simulation engineers to explore, analyze, and optimize hardware systems with remarkable speed and precision, seamlessly integrating AI capabilities into engineering workflows.

By bridging traditional simulation techniques with machine learning, we are revolutionizing the design, verification, manufacturing, and integration of the world’s most advanced semiconductors into complex systems.

Role Overview

As a key member of our Forward Deployment team in Asia Pacific, you will lead the charge in promoting the adoption of the vinci4d platform among top engineering firms. This influential leadership role involves building, mentoring, and managing a team of thermal and thermo-mechanical engineers who engage with potential clients and demonstrate the transformative power of our software.

You and your team will leverage extensive expertise in thermal and thermo-mechanical simulation, applying practical experience to validate customer designs using our platform. Through these interactions, you will illustrate how vinci4d facilitates substantial enhancements in product design, thermal and mechanical performance, reliability, and speed to market.

With a solid foundation in thermal physics and continuum mechanics, you will direct analyses of intricate physical phenomena, addressing steady-state and transient thermal behavior, linear and nonlinear mechanics, geometric and material nonlinearities, and contact interactions. Your team will assess critical elements such as thermal risks, warpage, stress evolution, and reliability across advanced semiconductor devices, electronic packages, and wafer-scale systems.

You will collaborate closely with customer engineering teams to grasp their technical challenges, provide expert insights, and effectively communicate vinci4d’s capabilities in resolving real-world issues. Additionally, you will act as a vital feedback conduit to our product and engineering teams, translating customer insights into actionable recommendations that inform product direction and drive continuous enhancement.

This is a remote position, involving close coordination with our Sales, Product, and Engineering teams based in Palo Alto, CA, USA. The role requires moderate travel, primarily within Asia, particularly to Korea and Taiwan, with occasional international travel for collaboration with the US team. This position may necessitate on-site presence several days a week in Singapore.

About vinci4d

At vinci4d, we are at the forefront of merging AI with hardware design, creating revolutionary tools that enhance the capabilities of engineers and designers worldwide. Our mission is to empower innovators by providing them with state-of-the-art technology that accelerates design processes and improves product outcomes.

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